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BITDIAMOND
Product line

Three products,
one acoustic base.

The acoustic tower, the low-frequency extension system and the transducer module are not three independent technical paths. They share the same EESM excitation, AMB suspension and AAIM impedance-control base — the only difference is what shape the same building blocks are stacked into.

Product render of the 16-unit acoustic tower: a gold faceted column with transparent diamond ballistic glass and a silver diamond-lathed diaphragm
AT-16
01 Flagship acoustic tower

16-Unit Acoustic Tower

A hexagonal honeycomb sealed enclosure with 16 × 120 mm EESM-AMB transducers stacked vertically delivers near-omni coverage through -3 dB/m vertical field attenuation.

  • Enclosure form
    120 × 140 × 1600 mm
  • Transducers
    16 × 120 mm EESM-AMB
  • Rear chamber volume
    1.5 L micro-sealed
  • Vertical field attenuation
    -3 dB/m
View technical details
3D product render of the Sub-Zero low-frequency extension system: a faceted bass system
SZ-1
02 Flagship low-frequency extension system

Sub-Zero Low-Frequency Extension System

A 5-inch FMLA sandwich composite diaphragm paired with dual 9.5-inch ultra-long-stroke drivers uses all-digital direct drive to push low-frequency error below the audible threshold.

  • Mid-bass driver
    5" FMLA sandwich composite diaphragm
  • Ultra-low driver
    2 × 9.5" ultra-long stroke
  • Amplifier
    700 W Class-D all-digital direct drive
  • Physical noise floor
    < 0.0005%
View technical details
Principle and structure deconstruction of the industrial 5-inch EESM test unit
ET-120
03 Core transducer module

EESM Coaxial Transducer

A 120 mm coaxial transducer module combining magnetless excitation with active magnetic levitation — the shared acoustic and mechanical foundation of the entire product line.

  • Diaphragm material
    CVD diamond / CNT airbag-foam composite
  • Diamond outer-skin sound speed
    17,320 m/s
  • Core layer density
    1/5 of a conventional paper cone
  • First breakup mode
    > 35 kHz
View technical details
BitDiamond system diagram: industrial-grade acoustic modules and the closed-loop control chain
Closed-loop control chain: DSP dynamic prediction → FPGA main controller → GaN power amplification → transducer, with actual state fed back by MEMS piezo sensors.
Modularity

Replaceable, and designed for expansion

The hardware is not soldered shut. DIP-8 standard socket modules let the amplifier, DSP and drive modules each be replaced on their own.

  • Lab-grade DIY

    A deliberate discovery-mod path: upgrade to op-amps such as Sparkos / OPA2134 yourself, without replacing the unit.

  • Designed for expansion

    Module slots are reserved for future expansion rather than soldered to today’s needs.

  • Sniff & Hear

    The "Sniff & Hear" mechanism lets the unit detect and sync cloud music libraries and firmware automatically.